三菱 三菱-IB(NA)-0800437E
資料介紹：
3.1 Handling Precautions
(1) Do not drop or give a strong impact to the case.
(2) Do not remove the printed-circuit board of the module from the
case.
Doing so may cause a failure.
(3) Be careful to prevent foreign matters such as cutting chips or wire
chips from entering the module.
Failure to do so may cause a fire, failure or malfunction.
(4) A protective film is attached to the module top to prevent foreign
matter such as wire chips from entering the module during wiring.
Do not remove the film during wiring.
Be sure to remove it for heat dissipation before system operation.
(5) Tighten the module fixing screws with the specified torque shown
below.
Insufficient tightening torque could result in short, failure or
malfunction.
(6) When mounting the module to the base unit, insert the module
fixing projection into the fixing hole in the base unit, and mount the
module with using the hole as a supporting point.
Incorrect module mounting may cause a malfunction, failure, or
drop of the module.
After mounting the Q68TD-G-H02 on the base unit, fix the module
with a module fixing bracket. (Refer to Section 3.1.1.)
(7) Always make sure to touch the grounded metal to discharge the
electricity charged in the body, etc., before touching the module.
Failure to do so may cause a failure or malfunctions of the module.
Table3.1 Tightening torque
Screw location Tightening torque range
Module fixing screw (M3 screw) 0.36 to 0.48N•m
Connector fixing screw (M2.6 screw) 0.20N•m
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